Rigid-flex PCB prototype

Rigid-flex PCB prototype support with stack-up and bend-risk review.

MWX PCB helps hardware teams confirm rigid-flex structure, PI material, coverlay, bend area, stiffener and manufacturing risk before release to production.

Send Rigid-Flex Files View Capabilities

30LRigid-flex max layer capability after review

12LFlexible board layer capability reference

PISF202, AP-series, Panasonic R-F775 and coverlay options

Engineering screening

Rigid-flex projects fail when bend and stack-up risks are checked too late.

Bend Area Review

Check bend radius, copper routing direction, coverlay window, stiffener position and transition area.

Stack-Up Confirmation

Review rigid area, flex area, adhesive, low-flow PP, PI and controlled impedance requirements.

Prototype Fit

Good for wearables, industrial modules, medical electronics, compact connectors and sensor assemblies.

Production Risk

Confirm panelization, yield risk, test method, surface finish and delivery before order release.

Materials

Flexible and rigid-flex material families used for project screening.

Available material references include PI SF202, SF305 adhesive, AP-85 series, AP-91 series, Panasonic R-F775 and SF305C coverlay. Final material choice depends on bend performance, thickness, impedance, availability and lead time.

Capability profile evidence used for advanced PCB process review.

PCB production equipment — Production equipment evidence for complex prototype projects.

Rigid-flex RFQ

Send drawings, bend requirements and Gerber files.

Include rigid/flex stack-up, bend direction, stiffener, surface finish, quantity and target lead time.