Manufacturing Resources

PCB production resources for prototype, NPI and low-volume projects.

MWX works around practical production questions: which process route fits the board, what inspection data is required, and how to keep engineering communication clear during the build.

Production Flow

Key process areas that support multilayer and special PCB builds.

PCB production equipment line — Automated production lines support repeatable prototype and low-volume PCB builds.

PCB wet process equipment line — Wet process capability is important for plating, surface preparation and process consistency.

CAM Engineering

Gerber review, stack-up check, impedance calculation, panelization, drill compensation, process notes and engineering question handling.

Inner Layer

LDI exposure, etching, AOI, line width control, spacing control and copper balance review for multilayer PCB production.

Lamination

Core and prepreg selection, press cycle, registration, resin flow and sequential lamination planning for multilayer and HDI structures.

Drilling & Laser

Mechanical drilling, laser drilling, controlled depth drilling, back drilling, routing, countersink and special hole processing.

Plating & Via Filling

Through-hole plating, copper thickness control, via filling, resin plugging, copper filling and reliability-oriented hole wall control.

Surface Finish

ENIG, OSP, HASL, lead-free HASL, immersion silver, immersion tin, hard gold and selective finish options according to application.

Inspection Resources

Testing and inspection items can be planned before order release.

PCB cleanroom process equipment — Clean production areas help control process stability for sensitive manufacturing steps.

PCB yellow room imaging process — Imaging and exposure processes require controlled handling before downstream production.

PCB microscope inspection equipment — Microscope inspection supports defect review, process confirmation and quality analysis.

Optical inspectionAOI and visual inspection for inner layer, outer layer and final appearance requirements

Electrical reliabilityFlying probe, fixture electrical test, open/short testing and electrical test reporting when required

Impedance controlImpedance coupon, TDR testing and impedance report for controlled impedance designs

MicrosectionCross-section inspection for plating thickness, hole wall, via structure and lamination quality

Mechanical checksBoard thickness, hole size, outline, slot, bevel, warpage and dimensional confirmation

Reliability supportSolderability, thermal stress, cleanliness, ionic contamination and customer-specific inspection items by request

Engineering Review

Send the production notes that matter most to your project before quotation.

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