Multilayer PCB
Standard 2L to high-layer-count multilayer PCB for industrial electronics, embedded systems, control boards, gateways, and computing hardware.
PCB Capabilities
Engineering-oriented PCB manufacturing capability for prototypes and low-volume builds.
MWX supports common and special PCB requirements through stable manufacturing resources, with DFM communication before release and production follow-up during the build.
Process Range
Typical PCB types and manufacturing technologies.
HDI PCB
Blind vias, buried vias, microvias, laser drilling, fine-pitch routing, and dense interconnect structures according to stack-up requirements.
High-Speed PCB
Controlled impedance, back drilling, low-loss material options, high-speed networking, optical module, AI edge, and data communication applications.
High-Frequency PCB
RF and microwave material options for communication, sensing, antenna, and industrial device projects where dielectric stability matters.
Rigid-Flex PCB
Rigid-flex and flexible PCB support for compact electronics, modules, connectors, cameras, sensors, and space-constrained product designs.
Special Requirements
Heavy copper, thick board, thin board, via-in-pad, resin plugged via, edge plating, castellated holes, countersink, and special outline processing.
Advanced PCB Technologies
Support for boards where stack-up, loss, via structure and process control matter.
Process route matters.
Advanced PCB work depends on matching the correct material, lamination plan, drilling route, copper thickness, surface finish and inspection method to the real design requirement.
HDI Build-Up
Laser microvias, blind/buried vias, sequential lamination, via filling and fine-pitch routing for compact industrial and embedded products.
High-Speed Design Support
Controlled impedance, low-loss material selection, differential pairs, back drilling, via stub control and stack-up discussion for high-speed signals.
High-Frequency Material
RF laminate options and hybrid stack-ups can be reviewed for antenna, communication, sensing and measurement-related applications.
Thermal & Power Boards
Heavy copper, metal base, thicker copper and thermal design considerations for power supply, motor control, LED and industrial control boards.
Reliability-Focused Builds
Material selection, plating reliability, hole wall quality, solderability, cleanliness and inspection reports can be planned before release.
Prototype-to-Pilot Transfer
Support from early engineering samples to small-batch repeat orders, with attention to stable stack-up, repeatability and inspection consistency.
Materials & Finish
Material and surface finish options are confirmed by project requirement.
Base materialsFR-4, high Tg FR-4, halogen-free, aluminum base, copper base, flexible material, rigid-flex material
High-speed / RFLow-loss and high-frequency material options such as Rogers, Taconic, Isola, Panasonic, Shengyi and other approved equivalents
Copper optionsStandard copper, heavy copper, inner and outer copper thickness confirmed by current, thermal and process needs
Surface finishHASL, lead-free HASL, ENIG, OSP, immersion silver, immersion tin, hard gold, selective gold where applicable
Solder mask / legendCommon solder mask colors, white or black legend, peelable mask, carbon ink and special marking options by request
Testing supportElectrical test, AOI, impedance test, dimensional inspection, microsection and additional checks when required
Final feasibility depends on stack-up, minimum line and spacing, minimum drill, material availability, copper thickness, surface finish, quantity, and lead-time target.
Detailed Capability Table
Engineering parameters for early PCB feasibility review.
Layer count1-40 layers supported depending on board structure, material, copper thickness, and reliability requirement
Board thicknessTypical 0.2-8.0 mm; thin board, thick board and special mechanical tolerance reviewed by design
Minimum line / spaceTypical 3/3 mil; finer design can be reviewed according to copper thickness, layer position and yield requirement
Minimum mechanical drillTypical 0.15 mm; smaller finished holes subject to aspect ratio, plating and reliability review
Laser microviaTypical 0.075-0.10 mm laser via options for HDI designs, confirmed by stack-up and capture pad design
Aspect ratioTypical up to 12:1; advanced structures reviewed according to board thickness, hole size and plating requirement
HDI structure1+n+1, 2+n+2, stacked / staggered microvias and advanced HDI structures subject to engineering review
Via processBlind via, buried via, via-in-pad, resin plugged via, copper filled via, back drilling and controlled depth drilling
Controlled impedanceSingle-ended and differential impedance with coupon and test report available when required; typical tolerance +/-10%
Copper thickness0.5 oz to 6 oz commonly supported; heavier copper reviewed according to line width, spacing and thermal requirement
Surface finishHASL, lead-free HASL, ENIG, OSP, immersion silver, immersion tin, hard gold, selective gold and carbon ink
Special profileV-cut, routing, beveling, castellated holes, countersink, counterbore, edge plating and press-fit hole control
The table is intended for early project screening. Final manufacturability is confirmed after reviewing Gerber, drill, stack-up, copper, material, impedance, outline and inspection requirements.
Material Families
Common laminate options for industrial, high-speed and RF applications.
FR-4
High Tg FR-4
Halogen-Free
CTI Material
Shengyi
Kingboard
ITEQ
Nanya
Isola
Panasonic Megtron
Rogers
Taconic
Manufacturing Resources
Production and inspection resources can be matched to the board risk.
Different PCB projects need different manufacturing routes. A simple 2-layer prototype, a 16-layer impedance board, a rigid-flex module and a heavy copper power board should not be treated the same way.
MWX helps confirm the practical production path, key process risks, inspection items and schedule before release, especially for prototype and NPI projects where engineering changes are common.
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