Need it faster? 24 / 48-hour expedited production is available for qualified PCB projects. Contact us for availability.
Review PCB manufacturing capabilities, lead times, supported materials, process options, and production equipment. PCB assembly and layout design support are also available.
1–50 Layers · HDI · Rigid-Flex · RF / Microwave / Rogers · Heavy Copper · Single- & Double-Sided PCB
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| Product Scope | Supported Range | Order Size | Lead-Time Unit |
|---|---|---|---|
| PCB Manufacturing | 1–50 Layers | Project Dependent | Working Days |
Explore our six PCB product categories. Select a product type to review its manufacturing capabilities, materials, processes and typical lead times.
| Process Item | Reference Capability |
|---|---|
| Layers (max) | 50 |
| Board thickness range | 0.20–5.60 mm |
| Outer-layer line width / spacing (min) | 3.0 / 3.0 mil |
| Outer-layer copper thickness (max) | 30 oz |
| Inner-layer copper thickness (max) | 15 oz |
| Aspect ratio (max) | 20:1 |
| Board thickness tolerance | t ≥ 0.8 mm: ±10%; t < 0.8 mm: ±0.08 mm |
| Finished hole diameter (mechanical drill) | 0.15–6.50 mm |
| Hole position tolerance (mechanical drill) | ±0.05 mm |
| Outline tolerance | ±0.05 mm (±2 mil) |
| Solder mask dam width (min) | 0.075 mm (green) / 0.125 mm (other colors) |
| Impedance tolerance | <50Ω: ±5Ω; ≥50Ω: ±10% |
| Surface finish | HAL LF, immersion gold, ENEPIG, immersion tin, immersion silver, OSP, hard gold fingers, carbon ink, peelable solder mask, etc. |
| Special process | POFV, buried / blind vias, back-drilling, controlled-depth milling, hybrid-material PCB, counterbore, copper-via plugging, etc. |
Reference lead times in working days. Quick-turn orders: ≤1 m². Standard orders: ≤15 m².
Expedited availability is subject to engineering review and production scheduling.
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| Product Type | Quick-Turn Production ≤1 m² / Order | Standard Production ≤15 m² / Order |
|---|---|---|
| Layer Count | Fastest Lead Time | Standard Lead Time |
| 2L | 1 | 5 |
| 4L | 2 | 5 |
| 6L | 3 | 6 |
| 8L | 3 | 7 |
| 10L | 4 | 9 |
| 12L | 4 | 9 |
| 14L | 5 | 10 |
| 16L | 5 | 11 |
| 18L | 6 | 12 |
| 20L | 7 | 13 |
| 22L | 8 | 14 |
| 24L | 9 | 15 |
| 26L | 10 | 16 |
| 28L | 11 | 17 |
| 30L | 12 | 19 |
| 32L | 13 | 21 |
| 34L | 14 | 23 |
| 36L | 15 | 25 |
| 38L | 16 | 27 |
| 40L | 17 | 29 |
| >40L | Case by case | Case by case |
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| Category | Models / Details | ||
|---|---|---|---|
 |
Conventional FR4 | SYTECH, TUC, ITEQ, KB | S1141/S1000H/S1000-2M; IT-158TC/IT-180ATC; KB-6160/KB-6165G/KB-6167F; TU-768/TU-865; ISOLA 370HR |
| Halogen free | SYTECH, TUC | S1150G; TU-747T/TU-865 | |
| High frequency | SYTECH, TUC, ROGERS, TACONIC, PANASONIC, WANGLING | S7135D/S7136; RO3003™/RO4003C™/RO4350B™/RO4730G3/RO5880; AGC TLY-5; ROGERS AD255C™; F4B | |
| High speed | SYTECH | TU-872 SLK/TU-883/TU-933+; M-4/M-6/M-7; IT-968/IT988G; ISOLA FR408/I-Speed®/Tachyon-100G | |
| High thermal conductivity / High CTI | SYTECH, DUPONT | ST115G/S1600 | |
| Flexible material | PI: SF202/SF305 (Adhesive); AP-85 Series/AP-91 Series; Panasonic R-F775; Coverlay: SF305C |
MWX PCB supports multilayer and high-layer PCB manufacturing for industrial control, communications, computing, power electronics and other demanding applications.
Projects can include controlled impedance, high-speed materials, blind and buried vias, heavy copper and other special process requirements.
HDI PCB projects can involve microvias, blind and buried vias, via filling and sequential lamination.
Gerber files, stack-up and impedance requirements are reviewed before production to confirm manufacturability and process requirements.
RF and microwave PCB manufacturing requires careful control of laminate selection, dielectric thickness, copper characteristics, impedance and fabrication tolerances.
MWX PCB supports RF PCB projects using specified high-frequency materials such as Rogers and other approved laminates.
Each project can include engineering review, DFM feedback, production follow-up, electrical testing, final inspection, and pre-shipment verification based on project requirements.
We support PCB prototyping, low-volume and volume production, as well as PCB assembly. PCB layout and design support is also available upon request.
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