Intended Flexing
A flex-to-install section is formed during assembly and normally remains stationary in service. A dynamically flexing section moves repeatedly, so its construction and mechanical requirements need review against the actual motion.
RIGID-FLEX PCB
Rigid-Flex PCB Manufacturing
We review rigid-flex stack-up, flex materials, bend areas, coverlay and stiffener requirements before quotation.
Rigid-Flex Project Snapshot
Please provide fabrication files, the stack-up and flex-zone drawing, bend, stiffener and coverlay notes, assembly outline and component restrictions, and target quantity. We will review manufacturability before quotation.
Construction
Rigid and flex sections · transition areas
Flex-zone details
Bend area · coverlay · stiffeners
Engineering review
Fabrication data · flex-zone drawing · assembly constraints
RIGID-FLEX PROJECT REVIEW
Flex-Zone & Stack-up Review
- Construction review: rigid and flex materials, bonding layers and transition areas are checked together.
- Bend and assembly review: intended flexing, coverlay, stiffeners, vias and traces are checked against the mechanical drawing.
- File review to quotation: submit fabrication data, flex-zone requirements and assembly constraints for engineering review.
Typical Applications: Industrial control, medical electronics, automotive electronics, robotics, aerospace, and compact electronic systems.
MANUFACTURING DETAILS
Rigid-Flex Construction Review
Transition and Bend-Area Routing
The rigid-to-flex transition, coverlay openings, and conductor routing are reviewed with the planned bend area. Vias, component pads, and abrupt stiffness changes are generally kept outside the active flex region.
Flex Construction and Stiffening
Flex thickness includes polyimide, copper, adhesive, and coverlay layers, each affecting bend behavior. No-flow bonding materials and local stiffeners are selected around the required rigid-flex construction and assembly support needs.
MANUFACTURING EXAMPLE
Rigid-Flex PCB Manufacturing Example
Rigid sections with integrated flex tails
Flexible tails link separate rigid circuit areas within one board. The transitions, coverlay openings and intended bends are checked with the final mechanical drawing before the construction is released.
- Rigid and flexible sections
- Integrated flex tails
- Transition and bend-area review
Technical Capabilities
| Process Item | Reference Capability |
|---|---|
| Layers | 4–50 layers |
| Coverlay Opening-to-Opening Spacing (min) | 0.2 mm |
| Coverlay-to-Pad Spacing (min) | 0.15 mm |
| Bonding Adhesives | Acrylic / modified acrylic, modified epoxy, and polyimide adhesive |
| FR-4 Application in Multilayer Flex Circuits | Flexible circuits laminated into a rigid-flex board, typically with vias. |
| Solder Mask | Coverlay, LPI |
| Finished Hole Diameter (max) | 6.30 mm |
| Hole-to-Hole Spacing (min) | 0.15 mm |
| Tooling Tolerances | Soft tooling: ±0.25 mm Hard tooling: ±0.05 mm CNC drilling / milling: ±0.10 mm |
| Copper Plating Thickness (PTH Only) | 8–15 μm; 20–30 μm; 30–70 μm (special) |
| Line Width / Spacing (min) | 18 μm finished copper: 3.5 / 3.5 mil 35 μm finished copper: 4.0 / 4.0 mil |
| Coverlay Opening-to-Outline Clearance | 0.20 mm (preferred) |
| Polyimide Film | Per customer requirements: 0.5 mil (12.5 μm) 1 mil (25 μm) 2 mil (50 μm) 3 mil (75 μm) 4 mil (100 μm) 5 mil (125 μm) |
| Copper Foil (RA or ED) | 1/4 oz to 3 oz |
| Stiffeners | Polyimide, rigid FR-4, pressure-sensitive adhesive, metal, or as requested by the customer |
| Finished Hole Diameter (min) | 0.20 mm |
| Hole Diameter Tolerance | ±0.05 mm |
| Conductor-to-Outline Edge Clearance (min) | ≥0.10 mm |
| Layer-to-Layer Misregistration (max) | ±0.10 mm |
| PCB Surface Finish | Immersion Gold, HASL, Lead-Free HASL, Hard Gold, OSP |
PCB Lead Time
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| PCB Specification | Order Area | Standard Lead Time | Fastest Lead Time |
|---|---|---|---|
| 4–40 Layers | ≤15 m² | 5–29 days | 2–17 days |
| 4–40 Layers | >15 m² | Contact us | Contact us |
| Above 40 Layers | Any | Project-specific | Project-specific |
Lead times are based on a six-day working week and exclude public holidays.
Special processes, such as heavy copper foil, peelable solder mask, and blind/buried vias, may require additional production time.
PCB lead time starts from the final confirmation of EQ.
We support 24-hour and 48-hour expedited production.
Please contact us to confirm feasibility and lead time.
All Supported Materials
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| Category | Manufacturers | Models / Details |
|---|---|---|
| Conventional FR4 | SYTECH, TUC, ITEQ, KB | S1141/S1000H/S1000-2M; IT-158TC/IT-180ATC; KB-6160/KB-6165G/KB-6167F; TU-768/TU-865; ISOLA 370HR |
| Halogen free | SYTECH, TUC | S1150G; TU-747T/TU-865 |
| High frequency | SYTECH, TUC, ROGERS, TACONIC, PANASONIC, WANGLING | S7135D/S7136; RO3003™/RO4003C™/RO4350B™/RO4730G3/RO5880; AGC TLY-5; ROGERS AD255C™; F4B |
| High speed | SYTECH | TU-872 SLK/TU-883/TU-933+; M-4/M-6/M-7; IT-968/IT988G; ISOLA FR408I/I-Speed®/Tachyon-100G |
| High thermal conductivity / High CTI | SYTECH, DUPONT | ST115G/S1600 |
| Flexible material | PI: SF202/SF305 (Adhesive); AP-85 Series/AP-91 Series; Panasonic R-F775; Coverlay: SF305C |
