Why Does PCB Prepreg Thickness Change After Lamination?
How resin content, glass style, inner-layer copper and the press cycle influence the final dielectric thickness of a multilayer PCB.
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Technical Articles
Practical notes on PCB design for manufacturability, special processes and engineering file preparation for engineering and purchasing teams.
HDI Stacked vs. Staggered Microvias: What to Confirm Before Choosing a Structure
Compare layer spans, routing space, via filling, sequential build-up and reliability when choosing an HDI stacked or staggered microvia structure.
READ ARTICLERogers RF Laminate Selection: Why One Dk Value Is Not Enough
Process and design Dk, loss, test conditions, copper and construction all matter when comparing Rogers RF laminates.
READ ARTICLEMulti-Step Drilling for Thick PCBs: Process and Quality Considerations
How board construction, entry and backup materials, controlled drilling, and inspection affect deep holes in thick multilayer PCBs.
READ ARTICLEResin-Filled Vias, Solder-Mask-Plugged Vias and Via-in-Pad
Resin filling, solder-mask plugging and via-in-pad describe different requirements. The right construction depends on the via location, assembly and fabrication process.
READ ARTICLERigid-Flex PCBs: Flex-to-Install vs. Dynamic Flexing
A flex section formed during installation faces different demands from one that moves repeatedly in service. The intended motion guides stackup and reliability review.
READ ARTICLEPCB Copper Thickness: Base Copper vs. Finished Copper
How starting foil, copper plating, and process losses affect finished copper thickness and the requirements recorded in a PCB stackup.
READ ARTICLEThe Compliance Red Line” for Medical Electronics PCBs – Meeting the Standards
Medical electronic devices are among the most strictly regulated products out there. From R&D to market launch, they have to go through multiple rounds of review by drug…
READ ARTICLEPCB Controlled Impedance: How Stack-Up, Trace Geometry and Materials Work Together
Why an impedance target cannot be separated from the actual stack-up, and which parameters, net information and test requirements should be supplied for manufacturing review.
READ ARTICLEFrom PCB Prototype to Low Volume: 8 Items to Reconfirm
Eight release checks covering file revision, prototype changes, stack-up, engineering questions, panelization, inspection, materials, packaging and delivery.
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