Multilayer & High-Layer PCB

Multilayer & High-Layer PCB Manufacturing

We review layer count, stack-up, copper distribution, drill and impedance requirements together before quotation.

Multilayer Project Snapshot

Please provide Gerber and NC Drill files, the target stack-up and impedance requirements, and any backdrill notes. We will review manufacturability before quotation.

Layer range

4–50 layers; construction reviewed per project

Engineering checks

Stack-up · impedance · drill and backdrill

File review

Gerber · NC Drill · fabrication notes

MULTILAYER PROJECT REVIEW

Stack-up, Drilling & File Review

Stack-up definition: layer order, dielectric construction and copper distribution are reviewed together.
Drill and impedance review: hole structure, target impedance and any backdrill stop layers are checked against the design.
Gerber review to quotation: submit the fabrication files and requirements for manufacturability review.

Typical Applications: Industrial control, telecommunications, data communication, servers, test equipment, medical electronics, and automotive electronics.

Multilayer PCB stack-up cross-section showing plated through holes, internal planes and layer construction.

MANUFACTURING DETAILS

Multilayer Stack-up and Drilling

Stack-up Definition

A multilayer stack-up defines layer order, dielectric construction, copper distribution, and the intended impedance geometry. Lamination must consolidate the selected cores and prepregs while maintaining registration between the internal circuitry.

Deep-Hole Drill Planning

When a finished hole is deep relative to its diameter, drill selection, chip removal, registration, and hole-wall condition need review together. These factors also affect later cleaning and plated-through-hole preparation.

Backdrill Review

Backdrilling removes an unused plated-through-hole stub after primary drilling and plating, helping reduce discontinuities in selected high-speed signal paths. It is specified separately from the primary drill plan and requires defined stop layers.

MANUFACTURING EXAMPLE

Multilayer PCB Manufacturing Example

28-layer high-speed board

This 28-layer board shows a dense multilayer construction using M6 high-speed material. Layer registration, lamination and plated-hole quality are reviewed as one stack-up rather than as separate process limits.

28 layers
M6 material
High-speed multilayer construction

Green 28-layer high-speed multilayer PCB with dense component pads and routed features.

Technical Capabilities

Process Item	Reference Capability
Layers (max)	50
Board thickness range	0.20–5.60 mm
Outer-layer line width / spacing (min)	3.0 / 3.0 mil
Outer-layer copper thickness (max)	30 oz
Inner-layer copper thickness (max)	15 oz
Aspect ratio (max)	20:1
Board thickness tolerance	t ≥ 0.8 mm: ±10%; t < 0.8 mm: ±0.08 mm
Finished hole diameter (mechanical drill)	0.15–6.50 mm
Hole position tolerance (mechanical drill)	±0.05 mm
Outline tolerance	±0.05 mm (±2 mil)
Solder mask dam width (min)	0.075 mm (green) / 0.125 mm (other colors)
Impedance tolerance	<50Ω: ±5Ω; ≥50Ω: ±10%
Surface finish	HAL LF, immersion gold, ENEPIG, immersion tin, immersion silver, OSP, hard gold fingers, carbon ink, peelable solder mask, etc.
Special process	POFV, buried / blind vias, back-drilling, controlled-depth milling, hybrid-material PCB, counterbore, copper-via plugging, etc.
Materials	High-Tg, halogen-free, and Rogers hybrid options

PCB Lead Time

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PCB Specification	Order Area	Standard Lead Time	Fastest Lead Time
4–40 Layers	≤15 m²	5–29 days	2–17 days
4–40 Layers	>15 m²	Contact us	Contact us
Above 40 Layers	Any	Project-specific	Project-specific

Lead times are based on a six-day working week and exclude public holidays.

Special processes, such as heavy copper foil, peelable solder mask, and blind/buried vias, may require additional production time.

PCB lead time starts from the final confirmation of EQ.

We support 24-hour and 48-hour expedited production.

Please contact us to confirm feasibility and lead time.

All Supported Materials

Material supplier logos including SYTECH, TUC, Rogers, KB, Panasonic, Isola, ITEQ, DuPont, Taconic and Wangling.