HDI PCB
Engineering review and manufacturing coordination for compact PCB designs using blind or buried vias, via-in-pad, and high-density routing structures.
MWX PCB reviews project requirements and coordinates feasibility, engineering feedback, inspection expectations, and production follow-up through the manufacturing route confirmed for the project.
Capability, materials, timing, inspection scope, and production resource are confirmed case by case after the actual files and requirements are reviewed.
HDI PCBTypical Applications
Application examples help frame the review; they are not a blanket capability or compliance commitment.
Capability Review
- Blind and buried via structure review
- Via-in-pad and resin-plugging review
- Sequential build and stack-up coordination
- Controlled impedance communication
- Advanced line and space reviewed case by case
Project-Specific Selection
- FR-4 material families selected by Tg and project requirements
- Copper and dielectric construction based on stack-up review
- Selected high-speed materials when required
- Final material brand and grade confirmed during engineering review
These are individual reference limits, not a promise that every limit can be combined in one design. Final feasibility depends on the complete Gerber data, stack-up, materials, quantity, quality scope, and production requirements and is confirmed through project-specific engineering review coordinated by MWX PCB.
Common Manufacturing Risks
- Microvia aspect ratio and reliability
- Via stacking or staggering requirements
- Copper balance and registration
- Solder mask clearance around fine-pitch features
- Resin plugging and planarization requirements
Inspection & Verification
- Applicable AOI and electrical test follow-up
- Microsection or via-quality evidence when specified
- Impedance verification when required
- Final inspection against approved fabrication requirements
Timing Confirmed After Review
Lead time is confirmed after stack-up, via structure, material availability, and sequential-build requirements are reviewed.
MWX PCB coordinates the project and does not claim ownership of the production factory, equipment, certifications, or qualifications used for the build.
HDI PCB Project Questions
Can you review an HDI stack-up before quotation?
Yes. Stack-up, via structure, material notes, impedance requirements, and key DFM risks can be reviewed before manufacturing coordination.
Are stacked microvias treated as standard capability?
No. Stacked or advanced microvia structures are reviewed case by case with the manufacturing resource confirmed for the project.
What files help with an HDI review?
Gerber or ODB++ data, fabrication drawings, stack-up, impedance notes, material requirements, quantity, and application information are useful.
Discuss Your HDI PCB Project
Send your design files or project requirements for feasibility review and practical engineering feedback.