RF / MICROWAVE / ROGERS PCB

Rogers RF & Microwave PCB Manufacturing

We review specified Rogers and other RF laminates, hybrid RF/FR-4 stack-ups, target impedance and Gerber data before quotation.

Request RF PCB Engineering Review

RF Project Snapshot

Please provide Gerber files, NC Drill files, stack-up information and impedance requirements. We will review the project requirements, confirm the material solution and evaluate manufacturing feasibility.

Rogers material options

RO4350B · RO4003C · RO3003

Other RF laminates

Taconic and Panasonic materials, subject to project review

Engineering review

Hybrid stack-up · controlled impedance · Gerber and manufacturability

RF PROJECT REVIEW

Material, Stack-up & File Review

Material selection: specified Rogers and other RF laminates are reviewed against the required construction.
Hybrid stack-up and impedance: dielectric, copper and target impedance requirements are reviewed together.
Gerber review to quotation: submit Gerber, stack-up and requirements for engineering review and quotation.

Cross-section comparison of FR4 and RO4350B high-frequency PCB materials.

MANUFACTURING DETAILS

RF Material and Stack-up Review

Dielectric Values and Test Conditions

A laminate Dk value is meaningful only with its stated test method, frequency, temperature, and construction. Circuit design values may differ from process test values, so the selected value should match the intended design model. For more context, see Rogers RF laminate selection beyond Dk.

Loss Beyond Dissipation Factor

Dissipation factor describes dielectric loss, while total insertion loss also reflects conductor profile, copper construction, line geometry, and frequency. Comparing RF materials therefore requires the relevant electrical and physical conditions together.

Hybrid Stack-up Bonding

Hybrid RF and FR-4 constructions combine materials with different electrical and processing characteristics. The stack-up, bonding layers, copper treatment, and critical RF geometry are reviewed together before the construction is released.

MANUFACTURING EXAMPLE

RF PCB Manufacturing Example

Six-layer filter board

This filter board pairs S7136H and TU862HF materials with a six-layer construction and immersion silver finish. Material selection, copper geometry and the required RF features are reviewed together.

6 layers
S7136H + TU862HF
Immersion silver

Panel of six-layer RF filter PCBs with repeated green circuit patterns.

Technical Capabilities

Process Item	Reference Capability
Outer-Layer Line Width / Spacing (min)	3.0 / 3.0 mil
Laser-Hole Diameter	0.075–0.15 mm
Laser Blind-Via Aspect Ratio	0.8:1
Antenna Accuracy	±15 μm (HOZ copper)
Antenna Verticality (Burr)	≤10 μm
Antenna Square-Pad Squareness	EA ≤10 μm
Materials	Rogers 3003 / 3003G2 / 3003RA; SY mmWave 77; Panasonic 5515; Isola MT77; AGC NF-30
Frequency Range	1–30 GHz
Board Thickness (min, including solder mask)	0.3 mm
Board Thickness (max)	6 mm
Board Size (max)	546 × 622 mm
Epoxy Resin Filled Vias	Yes
Via Capping (Thermal)	Yes
Surface Finish Types	OSP, HASL, ENIG, Immersion Silver, Immersion Tin, Hard Gold (Connector Board), Hard Gold (Selective Board), Soft Gold, ENEPIG

PCB Lead Time

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PCB Specification	Order Area	Standard Lead Time	Fastest Lead Time
4–40 Layers	≤15 m²	5–29 days	2–17 days
4–40 Layers	>15 m²	Contact us	Contact us
Above 40 Layers	Any	Project-specific	Project-specific

Lead times are based on a six-day working week and exclude public holidays.

Special processes, such as heavy copper foil, peelable solder mask, and blind/buried vias, may require additional production time.

PCB lead time starts from the final confirmation of EQ.

We support 24-hour and 48-hour expedited production.

Please contact us to confirm feasibility and lead time.

All Supported Materials

Material supplier logos including SYTECH, TUC, Rogers, KB, Panasonic, Isola, ITEQ, DuPont, Taconic and Wangling.