Complex PCB Manufacturing · PCB Assembly · PCB Layout & DesignShenzhen, China · david.xu@mwxpcb.com

Single- & Double-Sided PCB

Single- & Double-Sided PCB

Single- and double-sided PCB manufacturing from design review through production. Key checks include board thickness, copper weight, hole structure, surface finish, solder mask, routing, and manufacturability.

Typical Applications: Industrial control, power supplies, consumer electronics, test equipment, communication devices, and general electronic assemblies.

Technical Capabilities

ParameterManufacturing Capability
Maximum Product Size546 × 630 mm
Minimum Line Width / Spacing3 mil / 3 mil
Minimum Finished Hole Diameter0.15 mm
Minimum Solder Mask Opening0.025 mm
Minimum Solder Mask Dam Width0.075 mm
Maximum Finished Copper Thickness (Top / Bottom)3 oz / 3 oz
Profile Tolerance±0.1 mm
Drilled Hole Diameter Tolerance±0.05 mm
Minimum Finished Board Thickness0.3 mm
Maximum Finished Board Thickness3.0 mm
Appearance and Other RequirementsIPC-A-600H Class II

PCB Lead Time

Volume production lead time: 12–15 days. Please contact our sales team for details.

All Supported Materials

Material supplier logos including SYTECH, TUC, Rogers, KB, Panasonic, Isola, ITEQ, DuPont, Taconic and Wangling.

Swipe to view all columns

CategoryManufacturersModels / Details
Conventional FR4SYTECH, TUC, ITEQ, KBS1141/S1000H/S1000-2M; IT-158TC/IT-180ATC; KB-6160/KB-6165G/KB-6167F; TU-768/TU-865; ISOLA 370HR
Halogen freeSYTECH, TUCS1150G; TU-747T/TU-865
High frequencySYTECH, TUC, ROGERS, TACONIC, PANASONIC, WANGLINGS7135D/S7136; RO3003™/RO4003C™/RO4350B™/RO4730G3/RO5880; AGC TLY-5; ROGERS AD255C™; F4B
High speedSYTECHTU-872 SLK/TU-883/TU-933+; M-4/M-6/M-7; IT-968/IT988G; ISOLA FR408I/I-Speed®/Tachyon-100G
High thermal conductivity / High CTISYTECH, DUPONTST115G/S1600
Flexible materialPI: SF202/SF305 (Adhesive); AP-85 Series/AP-91 Series; Panasonic R-F775; Coverlay: SF305C

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