PCB Assembly Equipment
Image source: Shenzhen 1943 Technology Co., Ltd.
PCB Assembly Technical Specifications
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| Item | Category | Standard Process | Advanced / Non-Standard Process | |
|---|---|---|---|---|
| SMT PCB Requirements | PCB Size (L × W) | Maximum Limit | L ≤ 460 mm | L > 460 mm |
| W ≤ 400 mm | W > 400 mm | |||
| Minimum Limit | L ≥ 50 mm | L < 50 mm | ||
| W ≥ 30 mm | W < 30 mm | |||
| PCB Thickness | Maximum Limit | 4.5 mm | > 4.5 mm | |
| Minimum Limit | 0.5 mm | < 0.5 mm | ||
| SMT Component Capability | Specifications | Component Height (H) | ≤ 6.5 mm | 6.5 mm < H ≤ 15 mm |
| Maximum Component Size | 200 × 125 mm | > 200 × 125 mm | ||
| Minimum Component Size | 0201 | 01005 | ||
| 0.6 × 0.3 mm | 0.3 × 0.2 mm | |||
| Fine-Pitch ICs (QFP, SOP, SOJ, etc.) | Minimum Lead Pitch | 0.4 mm | 0.3 mm < Pitch < 0.4 mm | |
| CSP / BGA Packages | Minimum Ball Pitch | 0.5 mm | 0.3 mm < Pitch < 0.5 mm | |
| Inspection and Testing | Visual inspection, in-circuit testing (ICT), flying probe testing (FPT), automated optical inspection (AOI), automated X-ray inspection (AXI), and burn-in testing. | |||
