High-Speed Channel Planning
Stack-up details, reference planes, impedance targets and routing constraints are considered for serial links between processors, memory, storage and expansion devices.
PCB Solutions for Computers
Computer and specialized-computing boards combine high-speed interfaces, dense processors, memory and concentrated power demand. Stack-up, return paths, via transitions, copper distribution and thermal paths are considered as one system. MWX PCB supports multilayer and high-layer, HDI, and heavy-copper PCB manufacturing for these boards.
PCB Requirements & Manufacturing Considerations
Power Distribution
Copper weight, plane allocation, via arrays and local power regions are considered together for processor and accelerator networks with concentrated current.
Dense BGA Escapes
Pad geometry, annular-ring requirements, via types and clearances are considered for fine-pitch processor, memory and controller packages with dense escape routing.
Via Transition Control
Drill structures, back-drilling notes, stub limitations and via placement are considered where multilayer signal paths cross layers and connector regions.
Thermal Path Features
Finished copper, via filling and heat-spreading features are considered for copper regions, thermal vias and interface areas around heat-producing computing devices.
Fabrication Data Coordination
Layer tables, impedance information, drill data, controlled-depth features and test requirements are coordinated to identify ambiguities affecting the proposed board construction.
Typical Applications
- Rack Server Motherboards
- GPU and AI Accelerator Cards
- Storage Controller Boards
- Embedded Compute Modules
- Industrial Edge Servers
- High-Performance Data Acquisition Systems
Related PCB Technologies
Multilayer & High-Layer PCB
Multilayer and high-layer constructions can suit computer boards that need extensive routing between processors, memory, storage and expansion interfaces. Layer allocation, impedance definitions, power planes and drilling structures are considered against the supplied stack-up and layout.
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HDI PCB
HDI PCB construction can be relevant for compact compute modules and dense BGA escape areas. Microvias, via-in-pad options and sequential build-up requirements are assessed with pad design, routing density and the defined layer transitions.
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Heavy Copper PCB
Heavy copper PCB construction can be considered for boards with concentrated power conversion or high-current distribution regions. Copper thickness, plane geometry, plated features and thermal paths are reviewed in relation to the documented electrical and mechanical layout requirements.
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