PCB RFQ File Checklist: Gerber, Stack-Up, Quantity and Process Requirements

Complete project inputs make it easier to align quotation scope, engineering conditions and lead time in one review. The following checklist covers the information normally needed for bare PCB, special-process and PCBA quotations.

Why a PCB screenshot is not enough

A screenshot can help explain the product, but it normally cannot replace manufacturing data. Hole locations, layer definitions, board outline, copper weight, solder-mask openings and special processes must be confirmed from files suitable for engineering review. When key information is missing, a quotation can only be conditional.

1. Basic files for a bare-board RFQ

• Gerber or another mutually agreed manufacturing data format: include copper, solder mask, legend, profile and relevant mechanical layers.
• NC Drill files: distinguish plated holes, non-plated holes, slots and other special hole structures.
• Stack-up: for multilayer boards, provide layer order, dielectric structure, finished thickness and copper requirements. If the stack-up is not final, state that manufacturing input is required.
• Fabrication notes: include dimensions, tolerances, material, flame-retardant or halogen-free requirements, colors and surface finish.
• Revision identification: use the same part number, revision and release date across the data package, drawing and RFQ.

2. Quantity, timing and delivery information

• Required quantity and expected follow-on volume range
• Target ship date or project milestone, rather than only “as soon as possible”
• Single-board, array or customer-defined panel delivery
• Destination country or region, so manufacturing and transit time remain separate
• Split shipments, labels, barcodes or special packaging requirements

3. Process and quality requirements to call out separately

• Impedance nets, targets, tolerances and required test records
• Blind or buried vias, HDI, back drilling, controlled-depth drilling, via-in-pad or resin plugging
• RF, high-speed, heavy-copper, high-thermal-conductivity, rigid-flex or specified-material requirements
• Finished copper, hole copper, thickness, profile and other critical tolerances
• IPC class, inspection, microsection, first-article or customer-specific acceptance requirements

4. Additional information for PCBA

• BOM with manufacturer part numbers, reference designators, quantity, approved alternatives and do-not-fit markings
• Pick-and-place data, assembly drawings and paste-layer information
• Critical component, BGA orientation, polarity and special soldering instructions
• Consignment method, nominated supply channels and customer-supplied materials
• Programming, functional test, fixtures, burn-in, coating or box-build requirements

PCBA lead time depends on BOM completeness, material availability, fixtures, quantity and test scope. It should not be assumed from bare-board fabrication time alone.

5. Make one revision check before sending

1. Place the current release in one package and remove obsolete or temporary exports.
2. Confirm that Gerber, drill, stack-up, drawings and BOM use the same part number and revision.
3. Use a one-page RFQ summary for quantity, material, thickness, copper, finish, lead time and special processes.
4. Identify which parameters are fixed and which may be adjusted after engineering review.
5. Retain engineering questions and final approvals so prototype and low-volume builds use the same conditions.

What happens after submission

MWX can first check file completeness and obvious manufacturing risks, then coordinate quotation. Formal manufacturability and process review is confirmed by the engineering team at the manufacturing partner assigned to the project.

Confidentiality note: If an NDA is required before sensitive files are shared, state this in the project details. The website RFQ form accepts controlled project-file uploads up to 50 MB in total.

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