Complex PCB Manufacturing · PCB Assembly · PCB Layout & DesignShenzhen, China · david.xu@mwxpcb.com

HIGH-DENSITY INTERCONNECT

HDI PCB Manufacturing

We review HDI build-up, microvia and via-in-pad construction, drill data and target impedance before quotation.

Request HDI Engineering Review

HDI Project Snapshot

Please provide Gerber or ODB++ data with drill information, the HDI stack-up and microvia definition, plus impedance notes and component constraints. We will review manufacturability before quotation.

HDI build-up

Type I–IV · 1+n+1 to 4+n+4

Interconnect options

Microvias · stacked or staggered vias · via-in-pad

Engineering review

Stack-up · drill data · impedance requirements

HDI PROJECT REVIEW

HDI Build-up & File Review

Build-up definition: microvia layer connections, blind or buried vias and lamination sequence are reviewed together.
Via and impedance review: stacked or staggered microvias, via-in-pad treatment and target impedance are checked against the design.
File review to quotation: submit fabrication data, drill information and HDI stack-up for manufacturability review.

Typical Applications: Telecommunications, servers, consumer electronics, data communication, industrial control, medical electronics, automotive electronics, and high-density computing.

HDI PCB stack-up cross-section showing microvias, buried vias, target pads and capture pads.

MANUFACTURING DETAILS

HDI Interconnect Construction

Interconnect and Build-up Materials

Blind, buried, and plated through vias are defined by their layer connections, while microvias usually span adjacent build-up layers. The interconnect map and selected RCC or thin-core materials are reviewed together with the lamination sequence.

Stacked and Staggered Microvias

Staggered microvias are offset between levels and use lateral space for lands and routing. Stacked microvias align vertically, so the lower via typically needs filling and planarization before the next build-up layer. For more context, see stacked vs. staggered microvia review.

Via-in-Pad Construction

Via-in-pad identifies the via location within a component pad, not its treatment. For solderable pads, filling, planarization, and a copper cap can provide a flatter surface and limit solder wicking.

MANUFACTURING EXAMPLE

HDI PCB Manufacturing Example

14-layer optical-module board

This board combines a four-step HDI build-up with via-in-pad, resin-plugged vias, controlled-depth drilling and gold fingers. Those features are coordinated in the layer build-up and drill plan.

14 layers
Four-step HDI
Via-in-pad and resin-plugged vias

Fourteen-layer HDI PCB for an optical module, showing dense pads and gold fingers.

Technical Capabilities

Process Item	Reference Capability
Base Material	FR-4, Halogen Free, RCC, Ultra Thin Core, RF
Surface Treatment	ENIG + OSP, ENIG, Carbon + OSP, Immersion Tin, OSP
Min. Line / Spacing	2.0 / 2.0 mil
Critical Line Width Tolerance	2.5 mil ±15%
Min. Microvia Drill Size (Laser)	4.0 mil
Min. Capture / Target Pad Size	10.0 mil
Min. PTH & Buried Drill Bit	0.20 mm
Min. Annular Ring	3.5 mil
Max. PTH Aspect Ratio	10:1
Max. Microvia Aspect Ratio	0.8:1
Single-Ended Impedance	50–90 Ω: ±8% (but no less than 4 Ω)
Differential Impedance	100–155 Ω: ±10%
Solder Mask Clearance	1.5 mil
Solder Mask Dam	2.5 mil
Min. BGA / CSP Pitch	0.4 mm
Layer-to-Layer Registration	2.0 mil
Min. Dielectric Thickness	1.8 mil
PTH Hole Tolerance	±2 mil
Min. Outline Tolerance	±0.1 mm
Min. Core Thickness	3.0 mil
Hole Structure	Staggered Vias, Stacked Vias, Skip Vias, Stepped Vias, ELIC
HDI Type I–IV (IPC-2226A)	1+n+1 … 4+n+4
Other Technology	Carbon Jumper, LDI, DLD, Copper Filled Via, VOP

PCB Lead Time

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PCB Specification	Order Area	Standard Lead Time	Fastest Lead Time
4–40 Layers	≤15 m²	5–29 days	2–17 days
4–40 Layers	>15 m²	Contact us	Contact us
Above 40 Layers	Any	Project-specific	Project-specific

Lead times are based on a six-day working week and exclude public holidays.

Special processes, such as heavy copper foil, peelable solder mask, and blind/buried vias, may require additional production time.

PCB lead time starts from the final confirmation of EQ.

We support 24-hour and 48-hour expedited production.

Please contact us to confirm feasibility and lead time.

All Supported Materials

Material supplier logos including SYTECH, TUC, Rogers, KB, Panasonic, Isola, ITEQ, DuPont, Taconic and Wangling.

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Category	Manufacturers	Models / Details
Conventional FR4	SYTECH, TUC, ITEQ, KB	S1141/S1000H/S1000-2M; IT-158TC/IT-180ATC; KB-6160/KB-6165G/KB-6167F; TU-768/TU-865; ISOLA 370HR
Halogen free	SYTECH, TUC	S1150G; TU-747T/TU-865
High frequency	SYTECH, TUC, ROGERS, TACONIC, PANASONIC, WANGLING	S7135D/S7136; RO3003™/RO4003C™/RO4350B™/RO4730G3/RO5880; AGC TLY-5; ROGERS AD255C™; F4B
High speed	SYTECH	TU-872 SLK/TU-883/TU-933+; M-4/M-6/M-7; IT-968/IT988G; ISOLA FR408I/I-Speed®/Tachyon-100G
High thermal conductivity / High CTI	SYTECH, DUPONT	ST115G/S1600
Flexible material		PI: SF202/SF305 (Adhesive); AP-85 Series/AP-91 Series; Panasonic R-F775; Coverlay: SF305C

Send Us Your PCB Requirements

Upload your Gerber files or share your specifications for engineering review and quotation.

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